Show simple item record

dc.contributor.authorLi, Guo-Yang
dc.contributor.authorGower, Artur L.
dc.contributor.authorDestrade, Michel
dc.contributor.authorYun, Seok-Hyun
dc.date.accessioned2024-03-14T12:53:13Z
dc.date.available2024-03-14T12:53:13Z
dc.date.issued2022-09-17
dc.identifier.citationLi, Guo-Yang, Gower, Artur L., Destrade, Michel, & Yun, Seok-Hyun. (2022). Non-destructive mapping of stress and strain in soft thin films through sound waves. Communications Physics, 5(1), 231. doi:10.1038/s42005-022-01000-3en_IE
dc.identifier.issn2399-3650
dc.identifier.urihttp://hdl.handle.net/10379/18099
dc.description.abstractMeasuring the in-plane mechanical stress in a taut membrane is challenging, especially if its material parameters are unknown or altered by the stress. Yet being able to measure the stress is of fundamental interest to basic research and practical applications that use soft membranes, from engineering to tissues. Here, we present a robust non-destructive technique to measure directly in-situ stress and strain in soft thin films without the need to calibrate material parameters. Our method relies on measuring the speed of elastic waves propagating in the film. Using optical coherence tomography, we verify our method experimentally for a stretched rubber membrane, a piece of cling film (about 10 ¿m thick), and the leather skin of a traditional Irish frame drum. We find that our stress predictions are highly accurate and anticipate that our technique could be useful in applications ranging from soft matter devices to biomaterial engineering and medical diagnosis.en_IE
dc.description.sponsorshipThis study was supported by grants P41-EB015903, R01-EY027653, DP1-EB024242 from the National Institutes of Health (USA) for G.Y.L and S.H.Y; by the 111 Project for International Collaboration No. B21034 (Chinese Government, PR China), by the Seagull Program (Zhejiang Province, PR China), by the National Natural Science Foundation of China (No. 11872329), by the Natural Science Foundation of Zhejiang Province (No. LD21A020001), and by a travel grant from the UK Acoustic Network funded by the EPSRC (EP/R005001/1) for M.D.; by the Shift2Rail grant from the European Commission - Horizon 2020, and by the EPSRC (EP/V012436/1) for A.L.G.en_IE
dc.formatapplication/pdfen_IE
dc.language.isoenen_IE
dc.publisherNature Researchen_IE
dc.relation.ispartofCommunications Physicsen
dc.rightsAttribution 4.0 International (CC BY 4.0)
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subjectNon-destructive mappingen_IE
dc.subjectsoft thin filmsen_IE
dc.titleNon-destructive mapping of stress and strain in soft thin films through sound wavesen_IE
dc.typeArticleen_IE
dc.date.updated2024-03-12T16:32:27Z
dc.identifier.doi10.1038/s42005-022-01000-3
dc.local.publishedsourcehttps://doi.org/10.1038/s42005-022-01000-3en_IE
dc.description.peer-reviewedpeer-reviewed
dc.internal.rssid32874773
dc.local.contactMichel Destrade, Room Adb-1002 ¿Ras De Brun, School Of Mathematics, University Of Galway. Email: michel.destrade@universityofgalway.ie
dc.local.copyrightcheckedYes
dc.local.versionACCEPTED
nui.item.downloads132


Files in this item

Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record

Attribution 4.0 International (CC BY 4.0)
Except where otherwise noted, this item's license is described as Attribution 4.0 International (CC BY 4.0)